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Headlines
Background
ASML Investor Day takeaways: a first step in the back-end
In 2025, ASML will introduce a wide-field i-line scanner, marking the firm’s first step in the back-end semiconductor market.
Opinion
Techno-optimism: robotics and automation
For all the challenges surrounding operationalizing robotics, Jan Bosch observes enormous progress in automation over the last decade, especially where AI, electronics and mechanics are combined.
Background
Four essential reads on Gelsinger’s exit
A mercy retirement, a grilling of Intel’s board, the shackles of the US Chips Act and saving Intel Foundry first and foremost – here are the best analyses the web has to offer about Intel’s future after Pat Gelsinger’s surprise resignation.
Background
When the pressure mounts: Eindhoven’s Vitalwear takes on bed sores
The dreaded pressure ulcer may become a thing of the past thanks to a startup’s high-tech bed sheets that can detect the formation of the painful wounds.
Background
Data dashboards – also for engineering
Combining dashboards for operators and engineers allows for even faster analysis of production line issues. For now, artificial intelligence won’t take their place, Angelo Hulshout believes.
Background
ASML Investor Day takeaways: DRAM’s road ahead
For a product considered to be a commodity, DRAM has quite an exciting roadmap.
News
ASM, ASML and Nexperia not impacted by new US semicon export crackdown (for now)
ASM and ASML are exempt in a new round of US export curbs, although a national rule update could change that. Nexperia isn’t directly affected.
Background
“Hybrid bonding is one of the most competitive semicon equipment markets”
Suss Microtec stepped into the hybrid-bonding market this year with a machine focused on R&D. At Semicon Europe, Bits&Chips sat down with Thomas Schmidt to talk about his company’s hybrid-bonding strategy.
Editorial
ASML’s 2030 sales forecast is built on shaky foundations
AI-driven sales are a rather unreliable source of revenue for semiconductor equipment manufacturers in the medium term.
Background
Verifying and validating AI in safety-critical systems
AI regulations and verification and validation (V&V) processes will significantly impact safety-critical systems. Engineers need to employ V&V techniques that provide explainability and transparency for the AI models that run those systems. And as they use AI to aid in their V&V processes, it’s essential to explore a variety of testing approaches that address the increasingly complex challenges of AI technologies.
News
Philips’ MEMS foundry to continue as Xiver
Investor Cees Meeuwis is determined to make Philips’ MEMS business a commercial success. As an independent foundry, he expects Xiver to substantially expand its customer base.
Analysis
The EU Chips Act, act 2: a pivot to European strengths?
The new European Commission taking office is likely to pay more attention to the needs of Europe’s indigenous chipmakers, but it won’t throw out expensive technological sovereignty ambitions such as establishing domestic leading-edge semiconductor manufacturing operations.
Video
Bits&Chips talks to Marcel Pelgrom (part 4)
In a series of four interviews (in Dutch), 20-year Bits&Chips columnist Marcel Pelgrom looks back on his professional career.
News
VSParticle partners with Meta to speed up cleantech material development
Combining VSParticle’s versatile nanoparticle printer with Meta’s AI models to find and test new materials helps in the fight against climate change.