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Multiphysics simulations for 5G RFICs and SoCs

Laurent Ntibarikure is an application engineer at Ansys.

Reading time: 4 minutes

The transition to 5G is exciting but no small task given the degree of complexity at various points in the system. Multiphysics simulations simultaneously solve power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system to promote first-time silicon and system success.

System-on-chips (SoCs) and radio frequency integrated circuits (RFICs) for 5G smartphones and networks need to manage huge amounts of antenna data and offer significantly high processing capabilities in thermally and power-constrained environments. The growing interdependence of various multiphysics effects like timing, power, electromagnetics, thermal and reliability in sub-16nm designs poses significant challenges for design closure. Traditional margin-driven, silo-based design approaches to the chip, package and board have limited simulation coverage and fail to unravel potential design weaknesses, causing field failures.

Multiphysics simulations simultaneously solve power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system. Early analysis is key, but this comes with some requirements for SoC and intellectual property (IP) designs. The most important ones pertain to power efficiency, power integrity, reliability, advanced packaging and electromagnetic crosstalk.

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