Interview

“Power and RF should be priorities for European collaboration in chips”

René Raaijmakers
Reading time: 5 minutes

The Chip Integration Technology Center started with lead customers Ampleon, Nexperia and NXP, and is now courting material suppliers for packaging applications. In the next phase, CITC aims to commit manufacturers of back-end assembly equipment.

Barely established, the Chip Integration Technology Center (CITC) in Nijmegen was hit by corona. Not very practical for an organization that relies primarily on knowledge from its network. After all, development work not only takes place in the CITC labs in the Netherlands’ oldest city but also at TNO Radar Technology in The Hague, TNO-Holst in Eindhoven and the countless facilities of customers. The latter can often be found within walking distance, at Ampleon, EPR, Nexperia, NXP, PinkRF and Sencio on the Novio Tech Campus.

Nevertheless, CITC already is working with a few dozen partners. Four program lines are running: high power, RF, additively manufactured packages and integrated photonics. Time to catch up with Barry Peet, general manager at CITC since its inception.

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