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“Quick adoption of hybrid bonding with an entry at 10-micron pitches”
Reading time: 10 minutes
Back-end technology occupies an increasing part of the value chain for advanced chip systems. At the recent 3D & Systems Summit in Dresden, Bits&Chips spoke with Vishal Saroha, an analyst at the Yole Group, about advanced packaging trends and hybrid bonding.
Contrary to the traditional markets for chips, where we haven’t seen growth since COVID, AI still has an insatiable appetite for hardware. Analysts expect the demand to continue. According to Yole Group, more than 7 billion AI accelerators were produced in 2023 and this number will increase by an average of 17 percent over the next few years to 17.7 billion in 2029.
In delivering all that hardware, chip manufacturers are increasingly looking at 2.5D and 3D packaging. Yole calls this the high-end of the advanced packaging market. This part will grow steadily over the next few years, from 9 percent in 2023 to almost 40 percent by 2029.
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