“TSMC expects high-NA tool by end of September”

TSMC is standing by to receive its first high-NA EUV scanner from ASML by the end of September, according to Taiwanese news outlet Economic Daily News (via Trendforce). ASML previously confirmed that TSMC would receive a high-NA system this year, without providing a timeline.

The tool will be installed in the foundry’s R&D center for process technology development. Reportedly, TSMC plans on making limited use of high-NA EUV lithography for manufacturing A14P chips, which are scheduled to enter volume production in late 2027. Ahead of A14P are the N2 family (2025) and A16 (2025) and ‘plain’ A14 (2027) nodes.

There are two confirmed shipments of high-NA tools this year. Both went to Intel, which has been most aggressive in the adoption of the technology. The US company’s first ‘high-NA node,’ called Intel A14, has been tentatively scheduled to start manufacturing in 2026. Samsung is reportedly set to take delivery of a system by Q1 2025 at the latest.