TSMC ready for risk production of first ‘real’ EUV node

By announcing delivery of its complete 5nm design infrastructure, TSMC has kicked off 5nm risk production. The 5nm process is the first to rely heavily on EUV lithography, which according to the foundry ‘is making excellent progress in yield learning, achieving the best technology maturity at the same corresponding stage as compared to TSMC’s previous nodes’. TSMC previously employed EUV lithography in a select numbers of layers in its 7+nm process, an upgrade to the all-optical 7nm node. 7+nm volume production started at the end of March, according to Digitimes.