Chip Integration Technology Center (CITC) and Eindhoven University of Technology spinoff Antennex have signed an agreement to formalize their collaboration. Both organizations are active in the RF domain, especially in 100 GHz and beyond. Together, they address the characterization needs for next-generation high-frequency packaging applications.
Due to the need for more and more bandwidth in wireless communication, the next-gen communication standard (6G) is set to operate at frequencies around and above 100 GHz. This means a widespread adoption of devices where the antenna system is integrated into the device package (antenna-in-package, AiP). The high degree of integration, combined with the high operational frequencies, poses several challenges – not only for production but also for the characterization of materials and performance of the AiPs. At these high frequencies, material characterization and over-the-air device measurement simultaneously become more important and challenging. CITC and Antennex work together to address the characterization needs for these kinds of packaging applications.
“Working with Antennex is a welcome addition to our current ecosystem,” comments Francesca Chiappini, Program Manager RF Chip Packaging at CITC. “They enable us to develop novel packaging technologies and concepts for higher frequencies. For measurements at lower frequencies, we’re already working with the TNO Radar Technology department. With Antennex, we can now cover the frequency spectrum beyond 100 GHz. They help us tackle issues such as dielectric material characterization and antenna measurements at frequencies of relevance for 6G and automotive radar.”
Antennex co-founder Sander Bronckers adds: “Our services are complementary to CITC’s activities. When developing new equipment, tools and software, CITC helps us by providing extensive feedback. And they support us in defining requirements for measurements, analysis and characterization. Last but not least, CITC has a large network. By working together, we can offer our tools and services to companies better and more easily.”
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