Samsung Foundry targets mass production of 2nm chips by 2025 and 1.4nm by 2027, the company revealed during an in-house event. Concurrently, it plans on tripling its manufacturing capacity. Earlier this year, Samsung commenced 3nm-node production known as gate-all-around early (3GAE), which will get an upgrade to gate-all-around plus (3GAEP) next year.
Arch rival TSMC started 3nm mass production last month and also plans to kick off 2nm production in 2025 but ramp up in 2026. Intel is playing catch-up but has scheduled a 2nm node, called 20A, for mid-2024 and the 18A node for mid-2025. Please note all three manufacturers have different node definitions; density and performance aren’t necessarily interchangeable, despite using a similar node number.