14 November
Smart Photonics and Imec have signed a memorandum of understanding to underpin their intention to work together in the field of hybrid integration of indium phosphide (InP) on silicium nitride (SiN) and silicon photonics (SiPh). The collaboration focuses on flip-chip bonding, micro-transfer printing and component design related to hybrid integration, along with system demonstration and prototyping. The partners intend to accelerate the adoption and market pull of hybrid integrated solutions for domains such as datacom, automotive, agrifood and health.
