Paul van Gerven
17 April 2020

Tegema and Physik Instrumente (PI) have been working together to speed up assembly and packaging of photonic components, as well as increase the level of automation. Combining PI’s high-positioning systems with Tegema’s system integration expertise, a proof of concept has been built and the assembly platform will be launched at the end of the month. It offers up to ten times higher throughput than currently available solutions.

“Many customers request a much higher level of automation, for example when handling photonic chips or applying and curing adhesives. Tegema is an experienced system integrator that has year-long experience with such questions,” says Scott Jordan, head of the photonics market segment at PI.

Tegema platform
Credit: Tegema

Arno Thoer, director project solutions at Tegema, adds: “The already proven systems from PI form the heart of our platform concepts for the further automation of this process step. We want to contribute to speeding up this process considerably, minimizing the associated costs and thus helping the photonics industry to make a further breakthrough.”

Last week, Tegema announced another photonics assembly collaboration: with the Chip Integration Technology Center (CITC). This partnership is aimed at integrated photonics exclusively.

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