Thriving Besi partners with Applied for die-based hybrid bonding

Thanks to booming mobile end-markets, BE Semiconductor (Besi) reported a solid third quarter. The equipment maker based in Duiven saw revenue and net income reach 108.3 million and 34 million euros, respectively, which represent increases of 20.7 and 77.1 percent versus the same period last year. Orders are up too, by 15.5 percent, again thanks to new mobile product introductions and 5G capabilities. Besi also announced a partnership with Applied Materials for the development of die-based hybrid bonding solutions.

Looking ahead, Besi’s CEO Richard Blickman is “encouraged about the longer-term prospects in the next investment cycle given our strong performance during the last industry downturn and the current pandemic and by strong secular growth drivers. As chip functionality, complexity and density increase and geometries shrink, Besi’s advanced packaging solutions are ever more important to customers.”

“As such, we’re increasing our engagement with leading mobile, memory and logic players to expand our addressable market. In particular, we see significant market opportunities from the current 5G roll-out and initial orders from global memory producers for high-volume, high-accuracy flip-chip systems versus traditional wire bonding solutions,” Blickman continued.