Paul van Gerven
19 August

TSMC’s will commence massproduction of 3nm chips next month, according to the Commercial Times. Citing sources in the equipment industry and internal company briefings, the Taiwanese financial newspaper reports the N3 ramp-up proceeds in line with expectations and with good yield. The first chips are expected to be shipped early next year. Traditionally, Apple is TSMC’s first customer on a new node.

TSMC wafer
Credit: TSMC

TSMC says that its initial N3 node will deliver a performance increase of up to 10 to 15 percent, reduce power consumption by up to 25 to 30 percent and increase logic density by about a factor of 1.6 when compared to the previous N5 node. Over the next three years, the Taiwanese foundry will add another four sub-nodes to the N3 family before launching the N2 node in 2025.