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CITC and HAN course taps into increasing chip packaging complexity

As IC packaging becomes increasingly complex and integral to the success of the overall semiconductor design process, front-end engineers need to cooperate ever more closely with their back-end colleagues. CITC and the HAN University of Applied Sciences set up a packaging course to help them out.

Headlines

Qutech and co want to quantum-connect the Randstad
Neways acquiesces to automotive angst, axes 250
Academic Startup Competition announces its top 10
Ebusco and Rocsys link up for automated bus depots
Applied Materials bumps ASML back to runner-up in semi equipment market
Fastned lands France and €17M for further growth
TU Delft working on smart and communicative solar cells
Chip industry to grow 6 percent, top 15 by twice as much
Imec and KU Leuven flout Tesla’s keyless entry
Plant imaging goes low code
Grai Matter Labs gets $14M boost to edge AI
Major setbacks in China’s efforts to boost chip industry
TUE turns up the heat on e-waste
FME and TNO bring together Dutch electrolyzer companies
Agfa inks deal for Clariant’s printed-electronics materials
Samsung takes on TSMC in race to 3nm chips
Horizon Europe budget gets 4 billion boost
Imec launches “advanced RF” initiative for 6G devices
College student trainees help SMEs innovate
NXP helps Amazon to connect cars to the cloud
Antenna Company connects Wi-Fi 6 to enterprise and industrial IoT
VDL and Elringklinger rideshare for fuel-cell systems production
Agfa: continued strong Covid-19 impact, but gradual recovery
UT marries plain old silicon with exotic superlattice oxides
US has backup plan to block export of ASML’s EUV scanner to China

Dutch silicon anodes inch closer to the gigafactory

Nanotextured silicon anodes perform even better than expected, boosting battery energy density to world-record levels, startup Leydenjar found. Now the Dutch company has set out to develop high-throughput deposition equipment to take its superior anodes into gigafactories.

In other news

ICT acquires Esprit Management & IT Services (ICT)
Tech giants challenge US foreign worker crackdown (BBC)
US will reallocate military 3.5 GHz spectrum for consumer 5G in 2021 (Venturebeat)

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