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CITC and HAN course taps into increasing chip packaging complexity

As IC packaging becomes increasingly complex and integral to the success of the overall semiconductor design process, front-end engineers need to cooperate ever more closely with their back-end colleagues. CITC and the HAN University of Applied Sciences set up a packaging course to help them out.

Headlines

UT quantum computing institute doesn’t pick sides
Philips speeds up diagnosis and treatment of lung cancer
Sioux expansion builds production abilities
Benelux solar teams fill the podium at European Solar Challenge
Tesla takes battery production in-house to build 25k car
Noldus digs its heels in against damning Amnesty report
Salvia’s neurostimulatory foils raise 26 million
Battery patenting activity on a runaway
TNO and Lightyear carpool to advance solar tech
Braincreators and Advantech put heads together for AI on the edge
Differ leads search for better electrolysers
These innovation stimuli are included in the 2021 national budget
Futurelab pockets new investment and a new home at Evoluon
SALD deposits trust in new advisory board
Vanmoof pedals series B to a €34M payout
Ghent diagnostic startup Antelope gets injected with additional €9M
IBM aims to cross 1000 qubit border in 2023
Pandemic drives rise in fab equipment spending
Smarter bug checking by containing the state space explosion
EIT’s corona-tracking bracelet headed for Benelux events
TU Delft starts up robotics master
Nvidia acquires Arm in 40 billion dollar deal
Dutchies well-represented at Itea Awards of Excellence
SRON’s Gusto sensors are good to go
Twente researchers develop on-chip light amplifier

Dutch silicon anodes inch closer to the gigafactory

Nanotextured silicon anodes perform even better than expected, boosting battery energy density to world-record levels, startup Leydenjar found. Now the Dutch company has set out to develop high-throughput deposition equipment to take its superior anodes into gigafactories.

In other news

ICT acquires Esprit Management & IT Services (ICT)
Tech giants challenge US foreign worker crackdown (BBC)
US will reallocate military 3.5 GHz spectrum for consumer 5G in 2021 (Venturebeat)

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