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Holst Centre betting big on the foil battery

Can billions of micropillars make for a better battery than we currently have? Yes, Holst Centre believes, after the final piece of the puzzle fell into place in the lab recently. Now, the institute is looking to scale up and commercialize the technology.

Headlines

Vodafone probes Effect Photonics’ optical transceivers
Think tank: rejuvenate European IC design before building a fab
New investment primes Delft Circuits for industrialization
Amolf creates perovskite paintings by having the ink react with the canvas
National Growth Fund funds quantum and AI research agendas
TUE develops even smarter smart windows for greenhouses
Bestronics picks BIC to place PCB prototype production
TSMC calls worldwide plans for boosting chip production “unrealistic”
Trillion+ semiconductor units shipped again this year
Airbus and TNO link on laser-based aircraft communication
ICT accelerates growth plan with Profit and Strypes NL acquisitions
Port of Rotterdam commissions 77 hybrid-electrical AGVs with VDL
Sirius Medical goes international with US approval and UK implant
TSMC pouring 100 billion in capacity expansion
Delft SEM tweak results in 20x faster imaging
Quantum photonics company Quix makes its first sale
Inmarsat files suit over Dutch government 5G spectrum allocation
EU sends Hiber over the moon with €26M investment
Rabobank funds Amsterdam’s Optics11 companies for accelerated growth
Intel intends to build another fab in Europe
Philips sees Domestic Appliances off to a new home
Qutech builds scalable 4-qubit quantum processor
Intel goes on the offensive with “IDM 2.0” strategy
Dutch research consortia get millions to advance tech startups
Axign closes on $10M in new capital
Imec’s photonic-based ultrasonic sensor achieves new low in detection
Fab equipment spending looking at three consecutive growth years
Samsung and TSMC spend their way to world domination
Mini-Circuits connects to EU with Nijmegen office
Nexperia teams with Chinese en route to GaN power devices in EVs

CITC and HAN course taps into increasing chip packaging complexity

As IC packaging becomes increasingly complex and integral to the success of the overall semiconductor design process, front-end engineers need to cooperate ever more closely with their back-end colleagues. CITC and the HAN University of Applied Sciences set up a packaging course to help them out.

In other news

Tesla involved in smartwatch development, but why? (Electrek)
Demand for edge AI to surpass cloud AI by 2025 (EE Times)
Microsoft’s new two-screen phone: revolutionary or a disaster? (CNET)

Ask the headhunter

A few weeks after applying for an interesting management vacancy at a wireless technology company, I received a short rejection mail. This came as a big surprise to me as I’m clearly a top candidate for the job.