View this newsletter in your browser.

Holst Centre betting big on the foil battery

Can billions of micropillars make for a better battery than we currently have? Yes, Holst Centre believes, after the final piece of the puzzle fell into place in the lab recently. Now, the institute is looking to scale up and commercialize the technology.

Headlines

Dutch want photonics, AI and quantum in European Chips Act
Axelera AI attracts CTO from IBM Zurich
Samsung increases EUV layers in DRAM to five
Nvidia’s takeover of Arm dealt blow by EU
Hiber’s IoT service links with the UK’s Inmarsat Elera network
Mass production of Samsung’s 3nm node moved to next year
Eleo gives charge to Conmeq’s fully electric mini skid steer
Nowi’s PMIC brings energy autonomy to Nordic’s cellular IoT platform
Delft nanocoating startup secures €10M investment
UT caps computer science enrollment at 400
Delft quantum startup Qblox gets 20-qubit control stack order from Sweden
Globalfoundries seeks Nasdaq listing
Eurofins acquires Maser in bid for European expansion
Chip supply chain key issue in EU-US tech cooperation
ASML sees revenue opportunity of €24-30B in 2025
Oost NL new business loan accelerates Odyssey’s growth
Holst Centre and Neurogyn partner for advanced pelvic nerve neurostimulator
Dutch public-private consortium gets €95M for research on reliable AI
TUE spinoff Antennex signals it’s open for business
Nowi partners with Opticon to power energy-autonomous shopping labels
Kendrion locks up 3T acquisition
Quantum computing unicorn considers European HQ near Imec
Semiconductor boom might turn to glut in 2023, says IDC
The Netherlands joins European chip collaboration
$12M seed round brings Dutch stealth startup Axelera AI to light
Loop Robots cleans up with a $2M seed investment
TU Delft and NFI investigate next-gen forensic photography
Pharrowtech field-tests mm-wave-based fixed wireless access
Funding for large-scale research infrastructure “insufficient”
Dutch TUs stumble further in 2022 THE rankings

CITC and HAN course taps into increasing chip packaging complexity

As IC packaging becomes increasingly complex and integral to the success of the overall semiconductor design process, front-end engineers need to cooperate ever more closely with their back-end colleagues. CITC and the HAN University of Applied Sciences set up a packaging course to help them out.

In other news

Tesla involved in smartwatch development, but why? (Electrek)
Demand for edge AI to surpass cloud AI by 2025 (EE Times)
Microsoft’s new two-screen phone: revolutionary or a disaster? (CNET)

Ask the headhunter

A few weeks after applying for an interesting management vacancy at a wireless technology company, I received a short rejection mail. This came as a big surprise to me as I’m clearly a top candidate for the job.