View this newsletter in your browser.

Multibeam SEM shifts 3D cell imaging into top gear

Delft University of Technology is teaming up with a consortium of enterprises to develop an innovative device: a multibeam scanning electron microscope.

Headlines

ASML bags 4.3 billion dollar EUV order from Hynix
A peak inside Samsung’s EUV-made DRAM chips
Eleo gets recharged with Lumipol investment
Holst Centre breaks through with next-generation ultrasound monitor
ASML and Imec take EUV patterning to the limit
VLSI goes quantum in EU Flagship project
Elusive amorphous perovskites may increase solar cell efficiency
Imec finds energy-consumption milestone with new UWB transmitter chip

Semicon market screams for innovation in chip testing

When testing their chips, semiconductor manufacturers have to find a balance between developing their own equipment and purchasing solutions. Those who lead the way are faced with difficult choices.

In other news

Microsoft: we were wrong about open source (The Verge)
Who needs autonomous vehicles? (EE Times)
The tech the world is using to track corona – and people (Venturebeat)

Don’t be like everyone else

Being like everyone else lands you in a red ocean where cost and slim margins are the only things you can think about. Instead, be different in a way that matters to customers, find your blue ocean and build a great business.