 |
The end of the road(map)ASML CTO Martin van den Brink dropped a bombshell recently: the transistor could stop shrinking in ten years or so. The implications are far more serious for ASML itself than for semiconductor technology. |
 |
Taiwanese equipment builder integrates Polish additive technology for microcontact linesThe challenge in additive manufacturing for modern microelectronics is printing ultra-thin and highly conductive interconnects. The Polish company XTPL has developed an ultra-precise deposition technology that tackles this. |
 |
Hyper-NA after high-NA? ASML CTO Van den Brink isn’t convincedAfter decades of innovation in lithography, high-NA EUV might prove to be the end of the line, thinks ASML CTO Martin van den Brink. |
In other news |
| How Arm conquered the chip market without making a single chip (The Verge) |
| Europe’s first battery materials gigafactory is up and runnning (Evertiq) |
| Solving the mysteries of an ancient analog computer (Extremetech) |
| Posits, a new kind of number, improves the math of AI (IEEE Spectrum) |
 |
Ask the headhunterAfter accepting a job offer from the Canadian office of a leading semiconductor company, I gave notice to my current employer and set in motion the visa procedure with the Canadian authorities. Unfortunately, it’s still unclear when my electronic travel authorization will be granted. Meanwhile, I have no income, but I do have expenses. |
 |
Boost your digitalization: A/B testingCompanies in a digital transformation need to become very precise and quantitative in terms of what they aim to optimize for and then validate any potential improvement using experimental techniques such as A/B testing. |