A team of Imec researchers, together with scientists from Rutgers University, have participated in the finals of the Darpa Spectrum Collaboration Challenge. Their idea: using AI to teach wireless devices to avoid spectral collisions.
SoCs and RFICs for 5G smartphones and networks need to manage huge amounts of antenna data and offer significantly high processing capabilities in thermally and power-constrained environments. ANSYS multiphysics simulations solve challenges across the spectrum of chip, package and system. Download this white paper.
Analog Devices ADIN1300 10/100/1000 Gigabit Ethernet PHY integrates an Energy-Efficient Ethernet PHY core plus all the associated common analog circuitry, input and output clock buffering, the management interface, and subsystem registers.
Things are heating up in the X86 processor market. After taking a backseat to Intel for more than a decade, AMD (together with TSMC) has edged itself into technological leadership.
Jorijn van Duijn explores the dynamics behind the greatest high-tech innovation: the computer chip. This brand new book describes the history of ASM International between 1958 and 2008. Pre-order your copy now to receive a discount from the Techwatch bookstore.
Many agree that collecting and using data is an integral part of a digitalization strategy. The challenge is that they have one specific use in mind and don’t think in terms of a holistic view of the types of data and the possible uses of that data.