Onderwerpen-BC: Testen

Heterogeneous packaging trends bring on new thermal challenges

The shrinking device features, the growing device complexity and the new device materials introduced by heterogeneous semiconductor packaging have led to very high power densities, the potential for rapidly changing thermal events and the need for more advanced thermal imaging techniques. Using thermoreflectance-based imaging, many of the challenges can be met.

“Without statistics, you’re unlikely to find your best performance and realize consistency”

It’s easier than ever to do complex calculations and design simulations. Yet in the end, according to Wendy Luiten, it all boils down to how a design will work out of the lab, in a real product, in a real environment. That’s why she’s teaching a new course called “Applied statistics for R&D” at High Tech Institute. “Statistics is often under-applied, which is a pity because it can really contribute to success.”

Goodbye manual test cases, hello model-based testing

After many success stories in other markets, model-based testing is starting to gain momentum in high tech. Julien Schmaltz from CGI, Johan Poelsma from ICT and Bryan Bakker from Sioux are committed to strengthening the foothold.

Semiconductor testing grapples with cost and complexity

Supply chain collaboration, all-electrical testing and introduction of IP licensing into the semiconductor testing arena. These strategies to manage complexity and drive down costs will be hot topics during Salland Engineering’s upcoming Future of Test symposium in Zwolle.

Boost your digitalization: A/B testing

The only way out of this conundrum is to continuously test your assumptions with customers and the market and one of the most effective ways to do this when it comes to the product is by conducting experiments.