Rohde & Schwarz
Rohde & Schwarz
Volume: 2024
Issue: 4
Date: 17 May 2024
Volume: 2024
Issue: 4
Date: 17 May 2024

Intel speaks out on high-NA cost concerns

The chipmaker says high-NA EUV lithography is the most cost-effective option for the most challenging layers.
Paul van Gerven

This article is exclusively available to premium members of Bits&Chips. Already a premium member? Please log in. Not yet a premium member? Become one and enjoy all the benefits.

Login