“Hybrid bonding is one of the most competitive semicon equipment markets”

A few months ago, Germany’s Suss Microtec introduced a hybrid bonder that covers die-to-wafer as well as wafer-to-wafer process technologies for 200 mm and 300 mm substrates. For the development, it has teamed up with SET, a flip-chip specialist from France. The Germans build the equipment for plasma cleaning and metrology while the French provide the ultra-precision die bonders. “We’ve made fusion bonders for wafer-to-wafer bonding for many, many years,” explains Thomas Schmidt, product manager of bonding systems at Suss. “They require plasma cleaning, alignment and metrology. We combine these core competencies with the flip-chip competence of SET.”

In the partnership, Suss is also responsible for sales, maintenance and technical support. “This makes it easier for customers. But in the end, if we don’t know how to handle a placement problem, SET steps in.”