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US mulls gate-all-around, HBM export curbs
Looking to limit China’s access to AI chips, the Biden administration is considering expanding export restrictions to include gate-all-around (GAA) technology, according to a Bloomberg report. It’s unclear whether the ban would restrict China’s ability to develop its own GAA chips or go further and seek to block both US and foreign companies from selling AI products to Chinese firms. Curbs on high-bandwidth memory (HBM) are said to be under consideration as well.
![](https://bits-chips.nl/wp-content/uploads/2024/06/FinFET-GAA.jpg)
With gates completely enveloping the channel, the GAA field-effect transistor is the successor of the FinFET. All leading-edge chipmakers are adopting the technology in upcoming nodes, which are bound to be used to manufacture future generations of AI accelerators. Since atomic layer deposition (ALD) is a key technology for manufacturing GAA transistors, any additional US measures could affect Dutch ALD market leader ASM. The Dutch government has already banned the export of ALD equipment with certain capabilities.
HBM is a type of stacked DRAM that’s popular in AI accelerator chips owing to its high bandwidth at low power consumption and footprint. It’s supplied by SK Hynix and Samsung from South Korea and Micron from the US.