Growth of 300mm fab capacity picks up pace again

After dipping this year, the growth of 300mm semiconductor manufacturing capacity is set to gain momentum. Semi forecasts that fab capacity will grow to 9.6 million wafers per month in 2026, up from 6.0 million in 2022. “While the pace of the global 300mm fab capacity expansion is moderating, the industry remains squarely focused on growing capacity to meet robust secular demand for semiconductors,” says CEO Ajit Manocha of Semi. “The foundry, memory and power sectors will be major drivers of the new record capacity increase expected in 2026.”

Chipmakers expected to increase 300mm fab capacity during the 2022-2026 forecast period to meet growth in demand include Globalfoundries, Hua Hong Semiconductor, Infineon, Intel, Kioxia, Micron, Samsung, SK Hynix, SMIC, STMicroelectronics, Texas Instruments, TSMC and UMC. The companies are planning 82 new facilities and lines to start operations from 2023-2026.